HD Electrolytic Pure Copper Foil For Polyimide Board RoHS / SGS Approval

25um HD electrolytic ED copper foil for Polyimide board

Overview:

Rang of Thickness: 25micron

Range of Width: 1380 mm

Range of Length: 500-5000 M

Available ID: 76 mm,152 mm

Purity:99.8%

Features of high ductility ED copper foil:

1. Good etch ability

2. Excellent adhesion to etching resist

Classify :

The ED copper foils for PCB can be divided into below parts:

(STD-E)- standard electrodeposited copper foil

(HD-E)-high ductility electrodeposited copper foil

(HTE-E)-high temperature elongation electrodeposited copper foil

(LP-E)-low profile electrodeposited copper foil

(VLP-E)-very low profile electrodeposited copper foil

difference between CA copper foil and ED copper foil

1. Process: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process)

2. Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.

3. Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.

Package:wooden box

FAQ:

Q1: What's your guarantee?

A: All our products have 6 months guarantee after received goods, if any quality problem can contact us.

Q2: What's your delivery time ?

A: The common delivery time is 5-35 working days. The specific delivery time depends on the items and the quantity of your order.

Q3: What's your minimum order quantity?

A: MOQ is 150 kg.

Typical properties of high ductility copper foil